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| Electrostatic Deposition Solver Technology | ||
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The Numerical Approach: Electro-potential diffusion equation is solved to predict the Electro-potential distribution in the paint materials. Electro-current is derived by the Electro-potential gap on the surface and by the Electro-resistance due to the paint film. The growth ratio of the film thickness is estimated by the correlations which are a function of electric currency on the surface. The temperature effects on the film growth ratio have been taken into account. This code is now available for the process in which body is first dipped into the pool of paint materials then electric potential is loaded. The Analytical model: Electric potential is represented by the diffusion equation. The time derivative terms is assumed to be zero because it is very small. The Electric wall boundary condition is treated as follows;
The Numerical Procedure:
Verification Cases: |
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Case A: Simple Geometry: |
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| A simple geometry shown in Figure 1 is dipped into paint.
Figure 2 shows the mesh used for the computations. Figure 3 shows the boundary condition used for this case. Figure 4 shows the paint deposition thickness on plate faces B and C. Figure 5 represents the comparison of the results from ED with experimental data. The paint film thickness is very accurately predicted in the range between 7 micron and 15 micron. |
Figure 1: Geometry of the simple shape experiment and Close up of cathode plates
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Figure 2: Computational Domain and the mesh Figure 3: Electro-potential Boundary Condition |
Figure 4: Computation results on faces B and C Figure 5: Comparison of results with experimental data |
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| Case B: Auto Center Pillar Paint Application | ||
| Geometry shown in Figure 1 is used for this case. The mesh used for the surrounding box geometry is represented by the red box. Figure 2 show the results of the computation. The colors represents paint thickness. | ||
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Figure 1: Geometry and Computational Domain
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Figure 2: Results |
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